APA Цитирование

Seok, S. (2020). Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering. Springer International Publishing.

Chicago-стиль цитирования

Seok, Seonho. Advanced Packaging and Manufacturing Technology Based On Adhesion Engineering. Springer International Publishing, 2020.

MLA-цитирование

Seok, Seonho. Advanced Packaging and Manufacturing Technology Based On Adhesion Engineering. Springer International Publishing, 2020.

Предупреждение: эти цитированмия не могут быть всегда правильны на 100%.