Electronic materials /
This book is divided into six parts: The basic structures of solids; Electrical properties of solids; p-n junctions and related devices; Optical properties of solids; Magnetic and superconducting properties of solids; and Micromachines, sensors, and packaging materials.
में बचाया:
| मुख्य लेखक: | Kwok, H. L. |
|---|---|
| स्वरूप: | पुस्तक |
| भाषा: | English |
| प्रकाशित: |
Boston MA :
PWS,
1997.
|
| विषय: | |
| टैग : |
टैग जोड़ें
कोई टैग नहीं, इस रिकॉर्ड को टैग करने वाले पहले व्यक्ति बनें!
|
| Thư viện lưu trữ: | Mạng thư viện Đại học Đà Nẵng |
|---|
समान संसाधन
-
Electronic materials : inside electronic devices.
प्रकाशित: (1998) -
Electronic materials and processes handbook
द्वारा: Harper, Charles A.
प्रकाशित: (2003) -
Materials for high-density electronic packaging and interconnection
प्रकाशित: (1990) -
Ceramic materials for electronics
प्रकाशित: (2004) -
Electronic basis of the strength of materials
द्वारा: Gilman, John J.
प्रकाशित: (2003)


