Dyfyniad APA

(1998). 48th electronic components & technology conference: Interconnections packing Modeling & Simulation; Material & Processess reliability components manufacturring technology electronic packing education. Washington: EIA.

Dyfyniad Arddull Chicago

48th Electronic Components & Technology Conference: Interconnections Packing Modeling & Simulation; Material & Processess Reliability Components Manufacturring Technology Electronic Packing Education. Washington: EIA, 1998.

Dyfyniad MLA

48th Electronic Components & Technology Conference: Interconnections Packing Modeling & Simulation; Material & Processess Reliability Components Manufacturring Technology Electronic Packing Education. Washington: EIA, 1998.

Rhybudd: Mae'n bosib nad yw'r dyfyniadau hyn bob amser yn 100% cywir.