(1998). 48th electronic components & technology conference: Interconnections packing Modeling & Simulation; Material & Processess reliability components manufacturring technology electronic packing education. Washington: EIA.
Trích dẫn kiểu Chicago48th Electronic Components & Technology Conference: Interconnections Packing Modeling & Simulation; Material & Processess Reliability Components Manufacturring Technology Electronic Packing Education. Washington: EIA, 1998.
MLA Citation48th Electronic Components & Technology Conference: Interconnections Packing Modeling & Simulation; Material & Processess Reliability Components Manufacturring Technology Electronic Packing Education. Washington: EIA, 1998.
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