(1998). 48th electronic components & technology conference: Interconnections packing Modeling & Simulation; Material & Processess reliability components manufacturring technology electronic packing education. Washington: EIA.
استشهاد بنمط شيكاغو48th Electronic Components & Technology Conference: Interconnections Packing Modeling & Simulation; Material & Processess Reliability Components Manufacturring Technology Electronic Packing Education. Washington: EIA, 1998.
MLA استشهاد48th Electronic Components & Technology Conference: Interconnections Packing Modeling & Simulation; Material & Processess Reliability Components Manufacturring Technology Electronic Packing Education. Washington: EIA, 1998.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.