APA citiranje

(1998). 48th electronic components & technology conference: Interconnections packing Modeling & Simulation; Material & Processess reliability components manufacturring technology electronic packing education. Washington: EIA.

Trích dẫn kiểu Chicago

48th Electronic Components & Technology Conference: Interconnections Packing Modeling & Simulation; Material & Processess Reliability Components Manufacturring Technology Electronic Packing Education. Washington: EIA, 1998.

MLA citiranje

48th Electronic Components & Technology Conference: Interconnections Packing Modeling & Simulation; Material & Processess Reliability Components Manufacturring Technology Electronic Packing Education. Washington: EIA, 1998.