(1998). 48th electronic components & technology conference: Interconnections packing Modeling & Simulation; Material & Processess reliability components manufacturring technology electronic packing education. Washington: EIA.
Chicago-стиль цитирования48th Electronic Components & Technology Conference: Interconnections Packing Modeling & Simulation; Material & Processess Reliability Components Manufacturring Technology Electronic Packing Education. Washington: EIA, 1998.
MLA-цитирование48th Electronic Components & Technology Conference: Interconnections Packing Modeling & Simulation; Material & Processess Reliability Components Manufacturring Technology Electronic Packing Education. Washington: EIA, 1998.
Предупреждение: эти цитированмия не могут быть всегда правильны на 100%.