Full-field strain measurement of solder joints by using digital image correlation method

Παρόμοια τεκμήρια

• Solder Joint Reliability Prediction for Multiple Environments
  ανά: Perkins, Andrew E., κ.ά.
  Έκδοση: (2020)
• Electromigration and thermomigration in pb-free flip-chip solder joints /
  ανά: Chen, Chih.
• Advancements in Optical Methods & Digital Image Correlation in Experimental Mechanics, Volume 3
  ανά: Lin, Ming-Tzer, κ.ά.
  Έκδοση: (2020)
• Image Correlation for Shape, Motion and Deformation Measurements
  ανά: Sutton, Michael A., κ.ά.
  Έκδοση: (2020)
• Subcellular dynamics and protein conformation fluctuations measured by fourier imaging correlation spectroscopy /
  ανά: Senning, Eric N.