Full-field strain measurement of solder joints by using digital image correlation method
محفوظ في:
| اللغة: | vie |
|---|---|
| الوصول للمادة أونلاين: | https://dlib.udn.vn/module/chi-tiet-sach?RecordID=9604 |
| الوسوم: |
إضافة وسم
لا توجد وسوم, كن أول من يضع وسما على هذه التسجيلة!
|
| Thư viện lưu trữ: | Trung tâm Công nghệ thông tin và Học liệu số, Đại học Đà Nẵng |
|---|
مواد مشابهة
-
Solder Joint Reliability Prediction for Multiple Environments
بواسطة: Perkins, Andrew E., وآخرون
منشور في: (2020) -
Electromigration and thermomigration in pb-free flip-chip solder joints /
بواسطة: Chen, Chih. -
Advancements in Optical Methods & Digital Image Correlation in Experimental Mechanics, Volume 3
بواسطة: Lin, Ming-Tzer, وآخرون
منشور في: (2020) -
Image Correlation for Shape, Motion and Deformation Measurements
بواسطة: Sutton, Michael A., وآخرون
منشور في: (2020) -
Subcellular dynamics and protein conformation fluctuations measured by fourier imaging correlation spectroscopy /
بواسطة: Senning, Eric N.