Full-field strain measurement of solder joints by using digital image correlation method
Guardat en:
| Idioma: | vie |
|---|---|
| Accés en línia: | https://dlib.udn.vn/module/chi-tiet-sach?RecordID=9604 |
| Etiquetes: |
Afegir etiqueta
Sense etiquetes, Sigues el primer a etiquetar aquest registre!
|
| Thư viện lưu trữ: | Trung tâm Công nghệ thông tin và Học liệu số, Đại học Đà Nẵng |
|---|
Ítems similars
-
Solder Joint Reliability Prediction for Multiple Environments
per: Perkins, Andrew E., et al.
Publicat: (2020) -
Electromigration and thermomigration in pb-free flip-chip solder joints /
per: Chen, Chih. -
Advancements in Optical Methods & Digital Image Correlation in Experimental Mechanics, Volume 3
per: Lin, Ming-Tzer, et al.
Publicat: (2020) -
Image Correlation for Shape, Motion and Deformation Measurements
per: Sutton, Michael A., et al.
Publicat: (2020) -
Subcellular dynamics and protein conformation fluctuations measured by fourier imaging correlation spectroscopy /
per: Senning, Eric N.