Full-field strain measurement of solder joints by using digital image correlation method
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| Sprog: | vie |
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| Online adgang: | https://dlib.udn.vn/module/chi-tiet-sach?RecordID=9604 |
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| Thư viện lưu trữ: | Trung tâm Công nghệ thông tin và Học liệu số, Đại học Đà Nẵng |
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Lignende værker
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Solder Joint Reliability Prediction for Multiple Environments
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Udgivet: (2020) -
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Image Correlation for Shape, Motion and Deformation Measurements
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