Full-field strain measurement of solder joints by using digital image correlation method
保存先:
| 言語: | vie |
|---|---|
| オンライン・アクセス: | https://dlib.udn.vn/module/chi-tiet-sach?RecordID=9604 |
| タグ: |
タグ追加
タグなし, このレコードへの初めてのタグを付けませんか!
|
| Thư viện lưu trữ: | Trung tâm Công nghệ thông tin và Học liệu số, Đại học Đà Nẵng |
|---|
類似資料
-
Solder Joint Reliability Prediction for Multiple Environments
著者:: Perkins, Andrew E., 等
出版事項: (2020) -
Electromigration and thermomigration in pb-free flip-chip solder joints /
著者:: Chen, Chih. -
Advancements in Optical Methods & Digital Image Correlation in Experimental Mechanics, Volume 3
著者:: Lin, Ming-Tzer, 等
出版事項: (2020) -
Image Correlation for Shape, Motion and Deformation Measurements
著者:: Sutton, Michael A., 等
出版事項: (2020) -
Subcellular dynamics and protein conformation fluctuations measured by fourier imaging correlation spectroscopy /
著者:: Senning, Eric N.