Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliab...
Đã lưu trong:
| Những tác giả chính: | , , |
|---|---|
| Định dạng: | Sách |
| Ngôn ngữ: | English |
| Được phát hành: |
Springer
2015
|
| Những chủ đề: | |
| Truy cập trực tuyến: | https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/59126 |
| Các nhãn: |
Thêm thẻ
Không có thẻ, Là người đầu tiên thẻ bản ghi này!
|
| Thư viện lưu trữ: | Thư viện Trường Đại học Đà Lạt |
|---|
| id |
oai:scholar.dlu.edu.vn:DLU123456789-59126 |
|---|---|
| record_format |
dspace |
| spelling |
oai:scholar.dlu.edu.vn:DLU123456789-591262023-11-11T06:30:41Z Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability Lee, T.-K Bieler, Th.R Kim, C.-U Solder Soldering Lead-free This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research. 2015-11-05T01:20:21Z 2015-11-05T01:20:21Z 2015 Book 978-1-4614-9266-5 https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/59126 en application/pdf Springer |
| institution |
Thư viện Trường Đại học Đà Lạt |
| collection |
Thư viện số |
| language |
English |
| topic |
Solder Soldering Lead-free |
| spellingShingle |
Solder Soldering Lead-free Lee, T.-K Bieler, Th.R Kim, C.-U Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability |
| description |
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research. |
| format |
Book |
| author |
Lee, T.-K Bieler, Th.R Kim, C.-U |
| author_facet |
Lee, T.-K Bieler, Th.R Kim, C.-U |
| author_sort |
Lee, T.-K |
| title |
Fundamentals of Lead-Free Solder Interconnect Technology
From Microstructures to Reliability |
| title_short |
Fundamentals of Lead-Free Solder Interconnect Technology
From Microstructures to Reliability |
| title_full |
Fundamentals of Lead-Free Solder Interconnect Technology
From Microstructures to Reliability |
| title_fullStr |
Fundamentals of Lead-Free Solder Interconnect Technology
From Microstructures to Reliability |
| title_full_unstemmed |
Fundamentals of Lead-Free Solder Interconnect Technology
From Microstructures to Reliability |
| title_sort |
fundamentals of lead-free solder interconnect technology
from microstructures to reliability |
| publisher |
Springer |
| publishDate |
2015 |
| url |
https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/59126 |
| _version_ |
1819807857333239808 |