Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliab...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Lee, T.-K, Bieler, Th.R, Kim, C.-U
Format: Buch
Sprache:English
Veröffentlicht: Springer 2015
Schlagworte:
Online Zugang:https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/59126
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