Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliab...

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Hlavní autoři: Lee, T.-K, Bieler, Th.R, Kim, C.-U
Médium: Kniha
Jazyk:English
Vydáno: Springer 2015
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On-line přístup:https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/59126
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