Integrated Circuit Packaging, Assembly and Interconnections

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Tác giả chính:	Greig, William
Định dạng:	Sách
Ngôn ngữ:	English
Được phát hành:	Springer US 2020
Những chủ đề:	Engineering Electronics and Microelectronics, Instrumentation Circuits and Systems
Truy cập trực tuyến:	https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/82008
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Thư viện lưu trữ:	Thư viện Trường Đại học Đà Lạt

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record_format	dspace
spelling	oai:scholar.dlu.edu.vn:DLU123456789-820082023-10-06T02:09:19Z Integrated Circuit Packaging, Assembly and Interconnections Greig, William Engineering Electronics and Microelectronics, Instrumentation Circuits and Systems 2020-02-20T02:05:25Z 2020-02-20T02:05:25Z 2007 Book 978-0-387-28153-7 978-0-387-33913-9 https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/82008 en Springer-Verlag US application/pdf Springer US
institution	Thư viện Trường Đại học Đà Lạt
collection	Thư viện số
language	English
topic	Engineering Electronics and Microelectronics, Instrumentation Circuits and Systems
spellingShingle	Engineering Electronics and Microelectronics, Instrumentation Circuits and Systems Greig, William Integrated Circuit Packaging, Assembly and Interconnections
format	Book
author	Greig, William
author_facet	Greig, William
author_sort	Greig, William
title	Integrated Circuit Packaging, Assembly and Interconnections
title_short	Integrated Circuit Packaging, Assembly and Interconnections
title_full	Integrated Circuit Packaging, Assembly and Interconnections
title_fullStr	Integrated Circuit Packaging, Assembly and Interconnections
title_full_unstemmed	Integrated Circuit Packaging, Assembly and Interconnections
title_sort	integrated circuit packaging, assembly and interconnections
publisher	Springer US
publishDate	2020
url	https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/82008
_version_	1819827578121224192

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