Wafer Level 3-D ICs Process Technology
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Định dạng: | Sách |
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Springer US
2020
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oai:scholar.dlu.edu.vn:DLU123456789-845502023-10-06T04:44:17Z Wafer Level 3-D ICs Process Technology Tan, Chuan Seng Gutmann, Ronald J. Reif, L. Rafael Engineering Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Surfaces and Interfaces, Thin Films 2020-02-24T10:01:00Z 2020-02-24T10:01:00Z 2008 Book 978-0-387-76532-7 978-0-387-76534-1 https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/84550 en Integrated Circuits and Systems Springer-Verlag US application/pdf Springer US |
institution |
Thư viện Trường Đại học Đà Lạt |
collection |
Thư viện số |
language |
English |
topic |
Engineering Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Surfaces and Interfaces, Thin Films |
spellingShingle |
Engineering Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Surfaces and Interfaces, Thin Films Tan, Chuan Seng Gutmann, Ronald J. Reif, L. Rafael Wafer Level 3-D ICs Process Technology |
format |
Book |
author |
Tan, Chuan Seng Gutmann, Ronald J. Reif, L. Rafael |
author_facet |
Tan, Chuan Seng Gutmann, Ronald J. Reif, L. Rafael |
author_sort |
Tan, Chuan Seng |
title |
Wafer Level 3-D ICs Process Technology |
title_short |
Wafer Level 3-D ICs Process Technology |
title_full |
Wafer Level 3-D ICs Process Technology |
title_fullStr |
Wafer Level 3-D ICs Process Technology |
title_full_unstemmed |
Wafer Level 3-D ICs Process Technology |
title_sort |
wafer level 3-d ics process technology |
publisher |
Springer US |
publishDate |
2020 |
url |
https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/84550 |
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1819833032598618112 |