Copper Interconnect Technology
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| Format: | Book |
| Language: | English |
| Published: |
Springer New York
2020
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| Online Access: | https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/85312 |
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| Institutions: | Thư viện Trường Đại học Đà Lạt |
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oai:scholar.dlu.edu.vn:DLU123456789-853122023-10-06T05:42:24Z Copper Interconnect Technology Gupta, Tapan Engineering Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Circuits and Systems 2020-02-24T10:37:18Z 2020-02-24T10:37:18Z 2009 Book 978-1-4419-0075-3 978-1-4419-0076-0 https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/85312 en Springer-Verlag New York application/pdf Springer New York |
| institution |
Thư viện Trường Đại học Đà Lạt |
| collection |
Thư viện số |
| language |
English |
| topic |
Engineering Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Circuits and Systems |
| spellingShingle |
Engineering Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Circuits and Systems Gupta, Tapan Copper Interconnect Technology |
| format |
Book |
| author |
Gupta, Tapan |
| author_facet |
Gupta, Tapan |
| author_sort |
Gupta, Tapan |
| title |
Copper Interconnect Technology |
| title_short |
Copper Interconnect Technology |
| title_full |
Copper Interconnect Technology |
| title_fullStr |
Copper Interconnect Technology |
| title_full_unstemmed |
Copper Interconnect Technology |
| title_sort |
copper interconnect technology |
| publisher |
Springer New York |
| publishDate |
2020 |
| url |
https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/85312 |
| _version_ |
1819830830064730112 |