Materials for Advanced Packaging

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Những tác giả chính:	Lu, Daniel, Wong, C.P.
Định dạng:	Sách
Ngôn ngữ:	English
Được phát hành:	Springer International Publishing 2020
Những chủ đề:	Engineering Electronics and Microelectronics, Instrumentation Nanotechnology and Microengineering Metallic Materials
Truy cập trực tuyến:	http://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/85784
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id	oai:scholar.dlu.edu.vn:DLU123456789-85784
record_format	dspace
spelling	oai:scholar.dlu.edu.vn:DLU123456789-857842020-02-24T10:58:23Z Materials for Advanced Packaging Lu, Daniel Wong, C.P. Engineering Electronics and Microelectronics, Instrumentation Nanotechnology and Microengineering Metallic Materials 2020-02-24T10:58:23Z 2020-02-24T10:58:23Z 2017 Book 978-3-319-45097-1 978-3-319-45098-8 http://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/85784 en Springer International Publishing Switzerland application/pdf Springer International Publishing
institution	Thư viện Trường Đại học Đà Lạt
collection	Thư viện số
language	English
topic	Engineering Electronics and Microelectronics, Instrumentation Nanotechnology and Microengineering Metallic Materials
spellingShingle	Engineering Electronics and Microelectronics, Instrumentation Nanotechnology and Microengineering Metallic Materials Lu, Daniel Wong, C.P. Materials for Advanced Packaging
format	Book
author	Lu, Daniel Wong, C.P.
author_facet	Lu, Daniel Wong, C.P.
author_sort	Lu, Daniel
title	Materials for Advanced Packaging
title_short	Materials for Advanced Packaging
title_full	Materials for Advanced Packaging
title_fullStr	Materials for Advanced Packaging
title_full_unstemmed	Materials for Advanced Packaging
title_sort	materials for advanced packaging
publisher	Springer International Publishing
publishDate	2020
url	http://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/85784
_version_	1757659290118651904

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