Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach
Guardado en:
Autor principal: | Yazdani, Farhang |
---|---|
Formato: | Libro |
Lenguaje: | English |
Publicado: |
Springer International Publishing
2020
|
Materias: | |
Acceso en línea: | https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/86565 |
Etiquetas: |
Agregar Etiqueta
Sin Etiquetas, Sea el primero en etiquetar este registro!
|
Thư viện lưu trữ: | Thư viện Trường Đại học Đà Lạt |
---|
Ejemplares similares
-
More-than-Moore 2.5D and 3D SiP Integration
por: Radojcic, Riko
Publicado: (2020) -
Fundamentals of Electromigration-Aware Integrated Circuit Design
por: Lienig, Jens, et al.
Publicado: (2020) -
Design of CMOS Analog Integrated Fractional-Order Circuits
por: Tsirimokou, Georgia, et al.
Publicado: (2020) -
Inverter-Based Circuit Design Techniques for Low Supply Voltages
por: Palani, Rakesh Kumar, et al.
Publicado: (2020) -
Parasitic Substrate Coupling in High Voltage Integrated Circuits
por: Buccella, Pietro, et al.
Publicado: (2020)