Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
Gorde:
Egile nagusia: | Seok, Seonho |
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Formatua: | Liburua |
Hizkuntza: | English |
Argitaratua: |
Springer International Publishing
2020
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Gaiak: | |
Sarrera elektronikoa: | https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/86908 |
Etiketak: |
Etiketa erantsi
Etiketarik gabe, Izan zaitez lehena erregistro honi etiketa jartzen!
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Thư viện lưu trữ: | Thư viện Trường Đại học Đà Lạt |
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Process Variations in Microsystems Manufacturing. 1st ed.
nork: Huff, Michael
Argitaratua: (2020) -
Fan-Out Wafer-Level Packaging
nork: Lau, John H.
Argitaratua: (2020) -
Materials for Advanced Packaging
nork: Lu, Daniel, et al.
Argitaratua: (2020)