Lead finishing in semiconductor devices : soldering /
Enregistré dans:
| Auteur principal: | Tan, A. C. |
|---|---|
| Format: | Sách giấy |
| Publié: |
Singapore :
World Scientific,
1989.
|
| Tags: |
Ajouter un tag
Pas de tags, Soyez le premier à ajouter un tag!
|
| Thư viện lưu trữ: | Thư viện Trường Đại học Đà Lạt |
|---|
Documents similaires
-
Lead finishing in semiconductor devices : soldering /
par: Tan, A. C.
Publié: (1989) -
New Lead-Free Solders: Testing Device Development, Specimen Fabrication, and Characterization
par: Tao Quang Bang -
An introduction to semiconductor devices
par: Neamen, Donald A
Publié: (2006) -
Semiconductor physics and devices :
par: Neamen, Donald A.
Publié: (2012) -
Semiconductor physics and devices :
par: Neamen, Donald A.
Publié: (2012)


