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https:--dlib.udn.vn-module-chi-tiet-sach?RecordID=96042025-04-21T00:00:00ZFull-field strain measurement of solder joints by using digital image correlation methodXác định trường biến dạng trên toàn bộ chi tiết mối hàn bằng phương pháp tương quan ảnh sốTạp chí Khoa học và Công nghệ Đại học Đà Nẵng, Số 11(132). 2018, Quyển 2; Trang 1 - 4.vieĐại học Đà Nẵnghttps://dlib.udn.vn/module/chi-tiet-sach?RecordID=9604
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Trung tâm Công nghệ thông tin và Học liệu số, Đại học Đà Nẵng
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DSpace
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| language |
vie
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| title |
Full-field strain measurement of solder joints by using digital image correlation method
|
| spellingShingle |
Full-field strain measurement of solder joints by using digital image correlation method
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| title_short |
Full-field strain measurement of solder joints by using digital image correlation method
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| title_full |
Full-field strain measurement of solder joints by using digital image correlation method
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| title_fullStr |
Full-field strain measurement of solder joints by using digital image correlation method
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| title_full_unstemmed |
Full-field strain measurement of solder joints by using digital image correlation method
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| title_sort |
full-field strain measurement of solder joints by using digital image correlation method
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https://dlib.udn.vn/module/chi-tiet-sach?RecordID=9604
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