Full-field strain measurement of solder joints by using digital image correlation method

פריטים דומים

• Solder Joint Reliability Prediction for Multiple Environments
  מאת: Perkins, Andrew E., et al.
  יצא לאור: (2020)
• Electromigration and thermomigration in pb-free flip-chip solder joints /
  מאת: Chen, Chih.
• Advancements in Optical Methods & Digital Image Correlation in Experimental Mechanics, Volume 3
  מאת: Lin, Ming-Tzer, et al.
  יצא לאור: (2020)
• Image Correlation for Shape, Motion and Deformation Measurements
  מאת: Sutton, Michael A., et al.
  יצא לאור: (2020)
• Subcellular dynamics and protein conformation fluctuations measured by fourier imaging correlation spectroscopy /
  מאת: Senning, Eric N.