Full-field strain measurement of solder joints by using digital image correlation method

समान संसाधन

• Solder Joint Reliability Prediction for Multiple Environments
  द्वारा: Perkins, Andrew E., और अन्य
  प्रकाशित: (2020)
• Electromigration and thermomigration in pb-free flip-chip solder joints /
  द्वारा: Chen, Chih.
• Advancements in Optical Methods & Digital Image Correlation in Experimental Mechanics, Volume 3
  द्वारा: Lin, Ming-Tzer, और अन्य
  प्रकाशित: (2020)
• Image Correlation for Shape, Motion and Deformation Measurements
  द्वारा: Sutton, Michael A., और अन्य
  प्रकाशित: (2020)
• Subcellular dynamics and protein conformation fluctuations measured by fourier imaging correlation spectroscopy /
  द्वारा: Senning, Eric N.