Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect . 1st ed. 2018
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| Định dạng: | Sách |
| Ngôn ngữ: | English |
| Được phát hành: |
Springer Singapore
2020
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| Những chủ đề: | |
| Truy cập trực tuyến: | http://doi.org/10.1007/978-981-10-6165-3 https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/102986 |
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oai:scholar.dlu.edu.vn:DLU123456789-1029862023-10-06T18:24:39Z Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect . 1st ed. 2018 Cheng, Jie Engineering Tribology, Corrosion and Coatings Electronics and Microelectronics, Instrumentation 2020-09-11T13:11:31Z 2020-09-11T13:11:31Z 2018 Book 978-981-10-6164-6 978-981-10-6165-3 http://doi.org/10.1007/978-981-10-6165-3 https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/102986 en Springer Theses Springer Nature Singapore Pte Ltd. application/pdf Springer Singapore |
| institution |
Thư viện Trường Đại học Đà Lạt |
| collection |
Thư viện số |
| language |
English |
| topic |
Engineering Tribology, Corrosion and Coatings Electronics and Microelectronics, Instrumentation |
| spellingShingle |
Engineering Tribology, Corrosion and Coatings Electronics and Microelectronics, Instrumentation Cheng, Jie Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect . 1st ed. 2018 |
| format |
Book |
| author |
Cheng, Jie |
| author_facet |
Cheng, Jie |
| author_sort |
Cheng, Jie |
| title |
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect . 1st ed. 2018 |
| title_short |
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect . 1st ed. 2018 |
| title_full |
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect . 1st ed. 2018 |
| title_fullStr |
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect . 1st ed. 2018 |
| title_full_unstemmed |
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect . 1st ed. 2018 |
| title_sort |
research on chemical mechanical polishing mechanism of novel diffusion barrier ru for cu interconnect . 1st ed. 2018 |
| publisher |
Springer Singapore |
| publishDate |
2020 |
| url |
http://doi.org/10.1007/978-981-10-6165-3 https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/102986 |
| _version_ |
1819812558850228224 |