Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliab...
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Autori principali: | Lee, T.-K, Bieler, Th.R, Kim, C.-U |
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Natura: | Libro |
Lingua: | English |
Pubblicazione: |
Springer
2015
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Soggetti: | |
Accesso online: | https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/59126 |
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Thư viện lưu trữ: | Thư viện Trường Đại học Đà Lạt |
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