RF and Microwave Microelectronics Packaging II
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| Những tác giả chính: | , |
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| Định dạng: | Sách |
| Ngôn ngữ: | English |
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Springer International Publishing
2020
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| Truy cập trực tuyến: | https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/83668 |
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oai:scholar.dlu.edu.vn:DLU123456789-836682023-10-06T03:48:01Z RF and Microwave Microelectronics Packaging II Kuang, Ken Sturdivant, Rick Engineering Electronics and Microelectronics, Instrumentation Microwaves, RF and Optical Engineering Circuits and Systems 2020-02-24T09:17:14Z 2020-02-24T09:17:14Z 2017 Book 978-3-319-51696-7 978-3-319-51697-4 https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/83668 en Springer International Publishing AG application/pdf Springer International Publishing |
| institution |
Thư viện Trường Đại học Đà Lạt |
| collection |
Thư viện số |
| language |
English |
| topic |
Engineering Electronics and Microelectronics, Instrumentation Microwaves, RF and Optical Engineering Circuits and Systems |
| spellingShingle |
Engineering Electronics and Microelectronics, Instrumentation Microwaves, RF and Optical Engineering Circuits and Systems Kuang, Ken Sturdivant, Rick RF and Microwave Microelectronics Packaging II |
| format |
Book |
| author |
Kuang, Ken Sturdivant, Rick |
| author_facet |
Kuang, Ken Sturdivant, Rick |
| author_sort |
Kuang, Ken |
| title |
RF and Microwave Microelectronics Packaging II |
| title_short |
RF and Microwave Microelectronics Packaging II |
| title_full |
RF and Microwave Microelectronics Packaging II |
| title_fullStr |
RF and Microwave Microelectronics Packaging II |
| title_full_unstemmed |
RF and Microwave Microelectronics Packaging II |
| title_sort |
rf and microwave microelectronics packaging ii |
| publisher |
Springer International Publishing |
| publishDate |
2020 |
| url |
https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/83668 |
| _version_ |
1819815007390531584 |