More-than-Moore 2.5D and 3D SiP Integration
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| Tác giả chính: | |
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| Định dạng: | Sách |
| Ngôn ngữ: | English |
| Được phát hành: |
Springer International Publishing
2020
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| Những chủ đề: | |
| Truy cập trực tuyến: | http://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/83699 |
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| Thư viện lưu trữ: | Thư viện Trường Đại học Đà Lạt |
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oai:scholar.dlu.edu.vn:DLU123456789-836992020-02-24T09:18:39Z More-than-Moore 2.5D and 3D SiP Integration Radojcic, Riko Engineering Circuits and Systems Electronic Circuits and Devices Processor Architectures 2020-02-24T09:18:39Z 2020-02-24T09:18:39Z 2017 Book 978-3-319-52547-1 978-3-319-52548-8 http://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/83699 en Springer International Publishing AG application/pdf Springer International Publishing |
| institution |
Thư viện Trường Đại học Đà Lạt |
| collection |
Thư viện số |
| language |
English |
| topic |
Engineering Circuits and Systems Electronic Circuits and Devices Processor Architectures |
| spellingShingle |
Engineering Circuits and Systems Electronic Circuits and Devices Processor Architectures Radojcic, Riko More-than-Moore 2.5D and 3D SiP Integration |
| format |
Book |
| author |
Radojcic, Riko |
| author_facet |
Radojcic, Riko |
| author_sort |
Radojcic, Riko |
| title |
More-than-Moore 2.5D and 3D SiP Integration |
| title_short |
More-than-Moore 2.5D and 3D SiP Integration |
| title_full |
More-than-Moore 2.5D and 3D SiP Integration |
| title_fullStr |
More-than-Moore 2.5D and 3D SiP Integration |
| title_full_unstemmed |
More-than-Moore 2.5D and 3D SiP Integration |
| title_sort |
more-than-moore 2.5d and 3d sip integration |
| publisher |
Springer International Publishing |
| publishDate |
2020 |
| url |
http://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/83699 |
| _version_ |
1757677720929566720 |