Solder Joint Reliability Prediction for Multiple Environments
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| Những tác giả chính: | , |
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| Định dạng: | Sách |
| Ngôn ngữ: | English |
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Springer US
2020
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| Truy cập trực tuyến: | https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/84740 |
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oai:scholar.dlu.edu.vn:DLU123456789-847402023-10-06T04:55:26Z Solder Joint Reliability Prediction for Multiple Environments Perkins, Andrew E. Sitaraman, Suresh K. Engineering Electronics and Microelectronics, Instrumentation Metallic Materials Optical and Electronic Materials 2020-02-24T10:10:07Z 2020-02-24T10:10:07Z 2009 Book 978-0-387-79393-1 978-0-387-79394-8 https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/84740 en Springer-Verlag US application/pdf Springer US |
| institution |
Thư viện Trường Đại học Đà Lạt |
| collection |
Thư viện số |
| language |
English |
| topic |
Engineering Electronics and Microelectronics, Instrumentation Metallic Materials Optical and Electronic Materials |
| spellingShingle |
Engineering Electronics and Microelectronics, Instrumentation Metallic Materials Optical and Electronic Materials Perkins, Andrew E. Sitaraman, Suresh K. Solder Joint Reliability Prediction for Multiple Environments |
| format |
Book |
| author |
Perkins, Andrew E. Sitaraman, Suresh K. |
| author_facet |
Perkins, Andrew E. Sitaraman, Suresh K. |
| author_sort |
Perkins, Andrew E. |
| title |
Solder Joint Reliability Prediction for Multiple Environments |
| title_short |
Solder Joint Reliability Prediction for Multiple Environments |
| title_full |
Solder Joint Reliability Prediction for Multiple Environments |
| title_fullStr |
Solder Joint Reliability Prediction for Multiple Environments |
| title_full_unstemmed |
Solder Joint Reliability Prediction for Multiple Environments |
| title_sort |
solder joint reliability prediction for multiple environments |
| publisher |
Springer US |
| publishDate |
2020 |
| url |
https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/84740 |
| _version_ |
1819769927325712384 |