Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
Shranjeno v:
Glavni avtor: | Seok, Seonho |
---|---|
Format: | Knjiga |
Jezik: | English |
Izdano: |
Springer International Publishing
2020
|
Teme: | |
Online dostop: | https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/86908 |
Oznake: |
Označite
Brez oznak, prvi označite!
|
Thư viện lưu trữ: | Thư viện Trường Đại học Đà Lạt |
---|
Podobne knjige/članki
-
Micro-Manufacturing Technologies and Their Applications
od: Fassi, Irene, et al.
Izdano: (2020) -
Micro and Precision Manufacturing. 1st ed. 2018
od: Gupta, Kapil
Izdano: (2020) -
Process Variations in Microsystems Manufacturing. 1st ed.
od: Huff, Michael
Izdano: (2020) -
Fan-Out Wafer-Level Packaging
od: Lau, John H.
Izdano: (2020) -
Materials for Advanced Packaging
od: Lu, Daniel, et al.
Izdano: (2020)