New Lead-Free Solders: Testing Device Development, Specimen Fabrication, and Characterization
Chapter 1. General Introduction; Chapter 2. Literature review; Chapter 3. Micro-Tension machine and the interface; ...
Saved in:
| Main Author: | Tao Quang Bang |
|---|---|
| Language: | eng |
| Published: |
De L'Université Paris-Saclay
|
| Online Access: | https://dlib.udn.vn/module/chi-tiet-sach?RecordID=2881 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institutions: | Trung tâm Công nghệ thông tin và Học liệu số, Đại học Đà Nẵng |
|---|
Similar Items
-
Lead-Free Soldering
by: Bath, Jasbir
Published: (2020) -
Lead-Free Electronic Solders
by: Subramanian, KV
Published: (2020) -
A Guide to Lead-free Solders
by: Evans, John W., et al.
Published: (2020) -
Fundamentals of Lead-Free Solder Interconnect Technology
From Microstructures to Reliability
by: Lee, T.-K, et al.
Published: (2015) -
Lead finishing in semiconductor devices : soldering /
by: Tan, A. C.
Published: (1989)