A VERY LOW BANDGAP LINE-TUNNEL FIELD EFFECT TRANSISTOR WITH CHANNEL-BURIED OXIDE AND LATERALLY DOPED POCKET

Low bandgap and line tunneling techniques have demonstrated the most effectiveness in enhancing the on-current of tunnel field-effect transistors (TFETs). This study examines the mechanisms and designs of channel-buried oxide and a laterally doped pocket for a very low bandgap line-TFET. Numerical T...

Mô tả đầy đủ

Đã lưu trong:
Chi tiết về thư mục
Những tác giả chính: Bui, Huu Thai, Shih, Chun-Hsing, Nguyen, Dang Chien
Định dạng: Bài viết
Ngôn ngữ:English
Được phát hành: Trường Đại học Đà Lạt 2024
Những chủ đề:
Truy cập trực tuyến:https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/256919
https://tckh.dlu.edu.vn/index.php/tckhdhdl/article/view/1313
Các nhãn: Thêm thẻ
Không có thẻ, Là người đầu tiên thẻ bản ghi này!
Thư viện lưu trữ: Thư viện Trường Đại học Đà Lạt
id oai:scholar.dlu.edu.vn:DLU123456789-256919
record_format dspace
spelling oai:scholar.dlu.edu.vn:DLU123456789-2569192024-12-29T08:58:39Z A VERY LOW BANDGAP LINE-TUNNEL FIELD EFFECT TRANSISTOR WITH CHANNEL-BURIED OXIDE AND LATERALLY DOPED POCKET Bui, Huu Thai Shih, Chun-Hsing Nguyen, Dang Chien Band-to-band tunneling Channel-buried oxide Doping pocket Line tunneling Low bandgap TFET Low bandgap and line tunneling techniques have demonstrated the most effectiveness in enhancing the on-current of tunnel field-effect transistors (TFETs). This study examines the mechanisms and designs of channel-buried oxide and a laterally doped pocket for a very low bandgap line-TFET. Numerical TCAD simulations show that the channel-buried oxide is needed to prevent off-state lateral tunneling while still maintaining the on-state vertical tunneling. The buried oxide pillar should be high so that the channel is thin, about 10 nm thick, to completely suppress the tunneling leakage. The dopant pocket is required to trigger the line tunneling earlier than the point tunneling to improve the subthreshold swing and on-current. Increasing the pocket concentration or decreasing the pocket thickness both cause an increase not only in the vertical band bending but also in the effective gate-insulator thickness. Because of the trade-off between these two operation parameters, for a given thickness/concentration, there exists an optimal concentration/thickness of the pocket to maximize the on-current. The on-current is optimized using a heavy, thin pocket, for which the band bending is maximized and the effective gate-insulator thickness is minimized. For the fabrication feasibility using existing doping techniques, the pocket concentration and thickness should be 1019 cm-3 and 4 nm, respectively, to maximize the on-current of the InAs line-TFET. 2024-12-29T00:39:25Z 2024-12-29T00:39:25Z 2024 Article 0866-787X https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/256919 https://tckh.dlu.edu.vn/index.php/tckhdhdl/article/view/1313 10.37569/DalatUniversity.14.3S.1313(2024) en Dalat University Journal of Science, Volume 14, Issue 3S; p.61-75 application/pdf Trường Đại học Đà Lạt
institution Thư viện Trường Đại học Đà Lạt
collection Thư viện số
language English
topic Band-to-band tunneling
Channel-buried oxide
Doping pocket
Line tunneling
Low bandgap TFET
spellingShingle Band-to-band tunneling
Channel-buried oxide
Doping pocket
Line tunneling
Low bandgap TFET
Bui, Huu Thai
Shih, Chun-Hsing
Nguyen, Dang Chien
A VERY LOW BANDGAP LINE-TUNNEL FIELD EFFECT TRANSISTOR WITH CHANNEL-BURIED OXIDE AND LATERALLY DOPED POCKET
description Low bandgap and line tunneling techniques have demonstrated the most effectiveness in enhancing the on-current of tunnel field-effect transistors (TFETs). This study examines the mechanisms and designs of channel-buried oxide and a laterally doped pocket for a very low bandgap line-TFET. Numerical TCAD simulations show that the channel-buried oxide is needed to prevent off-state lateral tunneling while still maintaining the on-state vertical tunneling. The buried oxide pillar should be high so that the channel is thin, about 10 nm thick, to completely suppress the tunneling leakage. The dopant pocket is required to trigger the line tunneling earlier than the point tunneling to improve the subthreshold swing and on-current. Increasing the pocket concentration or decreasing the pocket thickness both cause an increase not only in the vertical band bending but also in the effective gate-insulator thickness. Because of the trade-off between these two operation parameters, for a given thickness/concentration, there exists an optimal concentration/thickness of the pocket to maximize the on-current. The on-current is optimized using a heavy, thin pocket, for which the band bending is maximized and the effective gate-insulator thickness is minimized. For the fabrication feasibility using existing doping techniques, the pocket concentration and thickness should be 1019 cm-3 and 4 nm, respectively, to maximize the on-current of the InAs line-TFET.
format Article
author Bui, Huu Thai
Shih, Chun-Hsing
Nguyen, Dang Chien
author_facet Bui, Huu Thai
Shih, Chun-Hsing
Nguyen, Dang Chien
author_sort Bui, Huu Thai
title A VERY LOW BANDGAP LINE-TUNNEL FIELD EFFECT TRANSISTOR WITH CHANNEL-BURIED OXIDE AND LATERALLY DOPED POCKET
title_short A VERY LOW BANDGAP LINE-TUNNEL FIELD EFFECT TRANSISTOR WITH CHANNEL-BURIED OXIDE AND LATERALLY DOPED POCKET
title_full A VERY LOW BANDGAP LINE-TUNNEL FIELD EFFECT TRANSISTOR WITH CHANNEL-BURIED OXIDE AND LATERALLY DOPED POCKET
title_fullStr A VERY LOW BANDGAP LINE-TUNNEL FIELD EFFECT TRANSISTOR WITH CHANNEL-BURIED OXIDE AND LATERALLY DOPED POCKET
title_full_unstemmed A VERY LOW BANDGAP LINE-TUNNEL FIELD EFFECT TRANSISTOR WITH CHANNEL-BURIED OXIDE AND LATERALLY DOPED POCKET
title_sort very low bandgap line-tunnel field effect transistor with channel-buried oxide and laterally doped pocket
publisher Trường Đại học Đà Lạt
publishDate 2024
url https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/256919
https://tckh.dlu.edu.vn/index.php/tckhdhdl/article/view/1313
_version_ 1822630718054858752