Arbitrary Modeling of TSVs for 3D Integrated Circuits

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth c...

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Những tác giả chính:	Salah, Khaled, Ismail, Yehea, El-Rouby, Alaa
Định dạng:	Sách
Ngôn ngữ:	English
Được phát hành:	Springer 2015
Những chủ đề:	Three-dimensional integrated circuits Mathematical models Engineering Circuits and Systems
Truy cập trực tuyến:	https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/57545
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spelling	oai:scholar.dlu.edu.vn:DLU123456789-575452023-11-11T05:46:25Z Arbitrary Modeling of TSVs for 3D Integrated Circuits Salah, Khaled Ismail, Yehea El-Rouby, Alaa Three-dimensional integrated circuits Mathematical models Engineering Circuits and Systems This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering. 2015-08-18T02:36:38Z 2015-08-18T02:36:38Z 2015 Book https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/57545 en application/pdf Springer
institution	Thư viện Trường Đại học Đà Lạt
collection	Thư viện số
language	English
topic	Three-dimensional integrated circuits Mathematical models Engineering Circuits and Systems
spellingShingle	Three-dimensional integrated circuits Mathematical models Engineering Circuits and Systems Salah, Khaled Ismail, Yehea El-Rouby, Alaa Arbitrary Modeling of TSVs for 3D Integrated Circuits
description	This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
format	Book
author	Salah, Khaled Ismail, Yehea El-Rouby, Alaa
author_facet	Salah, Khaled Ismail, Yehea El-Rouby, Alaa
author_sort	Salah, Khaled
title	Arbitrary Modeling of TSVs for 3D Integrated Circuits
title_short	Arbitrary Modeling of TSVs for 3D Integrated Circuits
title_full	Arbitrary Modeling of TSVs for 3D Integrated Circuits
title_fullStr	Arbitrary Modeling of TSVs for 3D Integrated Circuits
title_full_unstemmed	Arbitrary Modeling of TSVs for 3D Integrated Circuits
title_sort	arbitrary modeling of tsvs for 3d integrated circuits
publisher	Springer
publishDate	2015
url	https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/57545
_version_	1782550575900000256

Arbitrary Modeling of TSVs for 3D Integrated Circuits

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