3D Microelectronic Packaging
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Định dạng: | Sách |
Ngôn ngữ: | English |
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Springer International Publishing
2020
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Truy cập trực tuyến: | https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/85762 |
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oai:scholar.dlu.edu.vn:DLU123456789-857622023-10-06T06:16:01Z 3D Microelectronic Packaging Li, Yan Goyal, Deepak Engineering Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Electronic Circuits and Devices 2020-02-24T10:57:33Z 2020-02-24T10:57:33Z 2017 Book 978-3-319-44584-7 978-3-319-44586-1 https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/85762 en Springer Series in Advanced Microelectronics Springer International Publishing AG, part of Springer Nature application/pdf Springer International Publishing |
institution |
Thư viện Trường Đại học Đà Lạt |
collection |
Thư viện số |
language |
English |
topic |
Engineering Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Electronic Circuits and Devices |
spellingShingle |
Engineering Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Electronic Circuits and Devices Li, Yan Goyal, Deepak 3D Microelectronic Packaging |
format |
Book |
author |
Li, Yan Goyal, Deepak |
author_facet |
Li, Yan Goyal, Deepak |
author_sort |
Li, Yan |
title |
3D Microelectronic Packaging |
title_short |
3D Microelectronic Packaging |
title_full |
3D Microelectronic Packaging |
title_fullStr |
3D Microelectronic Packaging |
title_full_unstemmed |
3D Microelectronic Packaging |
title_sort |
3d microelectronic packaging |
publisher |
Springer International Publishing |
publishDate |
2020 |
url |
https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/85762 |
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1819805715763560448 |