MEMS/MOEMS packaging : Concepts, designs, materials, and processes
While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the prote...
Đã lưu trong:
| Tác giả chính: | |
|---|---|
| Định dạng: | Sách |
| Ngôn ngữ: | Undetermined |
| Được phát hành: |
New York
Mcgraw-hill
2005
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| Những chủ đề: | |
| Các nhãn: |
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| Thư viện lưu trữ: | Trung tâm Học liệu Trường Đại học Cần Thơ |
|---|
| LEADER | 01443nam a2200205Ia 4500 | ||
|---|---|---|---|
| 001 | CTU_191243 | ||
| 008 | 210402s9999 xx 000 0 und d | ||
| 082 | |a 621.381 | ||
| 082 | |b G476 | ||
| 100 | |a Gilleo, Ken | ||
| 245 | 0 | |a MEMS/MOEMS packaging : | |
| 245 | 0 | |b Concepts, designs, materials, and processes | |
| 245 | 0 | |c Ken Gilleo | |
| 260 | |a New York | ||
| 260 | |b Mcgraw-hill | ||
| 260 | |c 2005 | ||
| 520 | |a While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging. | ||
| 650 | |a Microelectronic packaging,Microelectromechanical systems,Optoelectronic devices,Đóng gói vi điện tử,Hệ thống vi cơ điện tử,Thiết bị quang điện | ||
| 904 | |i Qhieu | ||
| 980 | |a Trung tâm Học liệu Trường Đại học Cần Thơ | ||