3D Microelectronic Packaging

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3D Microelectronic Packaging

Wedi'i Gadw mewn:

Manylion Llyfryddiaeth
Prif Awduron:	Li, Yan, Goyal, Deepak
Fformat:	Llyfr
Iaith:	English
Cyhoeddwyd:	Springer International Publishing 2020
Pynciau:	Engineering Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Electronic Circuits and Devices
Mynediad Ar-lein:	https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/85762
Tagiau:	Ychwanegu Tag Dim Tagiau, Byddwch y cyntaf i dagio'r cofnod hwn!

Thư viện lưu trữ:	Thư viện Trường Đại học Đà Lạt

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Piezoelectric Transducers and Applications
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