Ceramic interconnect technology handbook

Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. Th...

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Detaylı Bibliyografya
Materyal Türü:	Kitap
Dil:	Undetermined
Baskı/Yayın Bilgisi:	Boca Raton CRC Press/Taylor & Francis 2007
Konular:	Electronic ceramics,Electronic packaging,Interconnects (Integrated circuit technology),Kỹ thuật truyền thông điện tử,Kết nối (Kỹ thuật nối mạch điện) Materials,Design and construction
Etiketler:	Etiketle Etiket eklenmemiş, İlk siz ekleyin!

Thư viện lưu trữ:	Trung tâm Học liệu Trường Đại học Cần Thơ

Diğer Bilgiler
Özet:	Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies

Ceramic interconnect technology handbook

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