Ceramic interconnect technology handbook

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Ceramic interconnect technology handbook

Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. Th...

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Wedi'i Gadw mewn:

Manylion Llyfryddiaeth
Fformat:	Llyfr
Iaith:	Undetermined
Cyhoeddwyd:	Boca Raton CRC Press/Taylor & Francis 2007
Pynciau:	Electronic ceramics,Electronic packaging,Interconnects (Integrated circuit technology),Kỹ thuật truyền thông điện tử,Kết nối (Kỹ thuật nối mạch điện) Materials,Design and construction
Tagiau:	Ychwanegu Tag Dim Tagiau, Byddwch y cyntaf i dagio'r cofnod hwn!

Thư viện lưu trữ:	Trung tâm Học liệu Trường Đại học Cần Thơ

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Multistage interconnection networks
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Materials for high-density electronic packaging and interconnection
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Ceramic materials for electronics
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Low Power Interconnect Design
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Microelectronic circuit design electronic design software /
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Kỹ thuật mạch điện tử
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Integrated circuit fabrication technology
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Ultra-Low-Voltage Design of Energy-Efficient Digital Circuits
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Mechanical behaviour of ceramics
gan: Davidge, R. W.
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SPICE circuit handbook
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SPICE circuit handbook
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Ceramic and semiconductor sciences in Japan
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Microelectronic circuit design
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Bipolar and mos analog integrated circuit design
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Bài giảng điện tử 2
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Lab Manual to Accompany Electronics for Computer Technology
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Thermoelectric performance of Bi- and Na-substituted Ca3Co4O9 improved through ceramic texturing /

Proceedings of the 1997 1st Electronic Packaging Technology Conference
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Pspice and Matlab for electronics : an integrated approach /
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Circuit Design for Reliability
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Giáo trình điện tử công nghiệp :
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VLSI circuit design methodology demystified :
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Fundamentals of electro-electronic circuits
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Mạch siêu cao tần
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Microelectronic circuits
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Microelectronic circuits
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