Ceramic interconnect technology handbook

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Ceramic interconnect technology handbook

Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. Th...

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書誌詳細
フォーマット:	図書
言語:	Undetermined
出版事項:	Boca Raton CRC Press/Taylor & Francis 2007
主題:	Electronic ceramics,Electronic packaging,Interconnects (Integrated circuit technology),Kỹ thuật truyền thông điện tử,Kết nối (Kỹ thuật nối mạch điện) Materials,Design and construction
タグ:	タグ追加タグなし, このレコードへの初めてのタグを付けませんか!

Thư viện lưu trữ:	Trung tâm Học liệu Trường Đại học Cần Thơ

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