Ceramic interconnect technology handbook

Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. Th...

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Định dạng:	Sách
Ngôn ngữ:	Undetermined
Được phát hành:	Boca Raton CRC Press/Taylor & Francis 2007
Những chủ đề:	Electronic ceramics,Electronic packaging,Interconnects (Integrated circuit technology),Kỹ thuật truyền thông điện tử,Kết nối (Kỹ thuật nối mạch điện) Materials,Design and construction
Các nhãn:	Thêm thẻ Không có thẻ, Là người đầu tiên thẻ bản ghi này!

Thư viện lưu trữ:	Trung tâm Học liệu Trường Đại học Cần Thơ


LEADER	01324nam a2200205Ia 4500
001	CTU_154936
008	210402s9999 xx 000 0 und d
020			\|c 2846000
082			\|a 621.381046
082			\|b C411
245		0	\|a Ceramic interconnect technology handbook
245		0	\|c Edited by Fred D. Barlow III, Aicha Elshabini
260			\|a Boca Raton
260			\|b CRC Press/Taylor & Francis
260			\|c 2007
520			\|a Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies
650			\|a Electronic ceramics,Electronic packaging,Interconnects (Integrated circuit technology),Kỹ thuật truyền thông điện tử,Kết nối (Kỹ thuật nối mạch điện)
650			\|x Materials,Design and construction
904			\|i Nguyên
980			\|a Trung tâm Học liệu Trường Đại học Cần Thơ

Ceramic interconnect technology handbook

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