Ceramic interconnect technology handbook

Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. Th...

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Opis bibliograficzny
Format:	Książka
Język:	Undetermined
Wydane:	Boca Raton CRC Press/Taylor & Francis 2007
Hasła przedmiotowe:	Electronic ceramics,Electronic packaging,Interconnects (Integrated circuit technology),Kỹ thuật truyền thông điện tử,Kết nối (Kỹ thuật nối mạch điện) Materials,Design and construction
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Thư viện lưu trữ:	Trung tâm Học liệu Trường Đại học Cần Thơ

Ceramic interconnect technology handbook

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