Tribology in chemical mechanical planarization
Illustrating their intersecting role in manufacturing and technological development, this book examines tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects as well as friction, lubrication fundamentals, and...
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| Tác giả chính: | |
|---|---|
| Định dạng: | Sách |
| Ngôn ngữ: | Undetermined |
| Được phát hành: |
London
Taylor and Francis
2004
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| Những chủ đề: | |
| Các nhãn: |
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| Thư viện lưu trữ: | Trung tâm Học liệu Trường Đại học Cần Thơ |
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| LEADER | 01230nam a2200205Ia 4500 | ||
|---|---|---|---|
| 001 | CTU_97184 | ||
| 008 | 210402s9999 xx 000 0 und d | ||
| 020 | |c 2399000 | ||
| 082 | |a 621.9 | ||
| 082 | |b L693 | ||
| 100 | |a Liang, Hong | ||
| 245 | 0 | |a Tribology in chemical mechanical planarization | |
| 245 | 0 | |c Hong Liang, David Craven | |
| 260 | |a London | ||
| 260 | |b Taylor and Francis | ||
| 260 | |c 2004 | ||
| 520 | |a Illustrating their intersecting role in manufacturing and technological development, this book examines tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects as well as friction, lubrication fundamentals, and the basics of wear. The book concludes its focus with mechanical aspects of CMP, pad materials, elastic modulus, and cell buckling. As the first source to integrate CMP and tribology, Tribology in Chemical-Mechanical Planarization provides applied scientists and engineers in the fields of semiconductors and microelectronics with clear foresight to the future of this technology | ||
| 650 | |a Tribology,Grinding and polishing | ||
| 904 | |i M.Loan | ||
| 980 | |a Trung tâm Học liệu Trường Đại học Cần Thơ | ||