Electromigration and thermomigration in pb-free flip-chip solder joints /

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Electromigration and thermomigration in pb-free flip-chip solder joints /

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書誌詳細
第一著者:	Chen, Chih.
その他の著者:	Tong, H.M., Tu K.N.
フォーマット:	論文
言語:	English
主題:	Current stressing Diffusion Joule heating Microelectronic packaging Reliability Thermal gradient Underbump metallizaiton
タグ:	タグ追加タグなし, このレコードへの初めてのタグを付けませんか!

Thư viện lưu trữ:	Thư viện Trường Đại học Đà Lạt

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