Electromigration and thermomigration in pb-free flip-chip solder joints /

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Electromigration and thermomigration in pb-free flip-chip solder joints /

Wedi'i Gadw mewn:

Manylion Llyfryddiaeth
Prif Awdur:	Chen, Chih.
Awduron Eraill:	Tong, H.M., Tu K.N.
Fformat:	Erthygl
Iaith:	English
Pynciau:	Current stressing Diffusion Joule heating Microelectronic packaging Reliability Thermal gradient Underbump metallizaiton
Tagiau:	Ychwanegu Tag Dim Tagiau, Byddwch y cyntaf i dagio'r cofnod hwn!

Thư viện lưu trữ:	Thư viện Trường Đại học Đà Lạt

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