Electromigration and thermomigration in pb-free flip-chip solder joints /

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Electromigration and thermomigration in pb-free flip-chip solder joints /

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Detalles Bibliográficos
Autor Principal:	Chen, Chih.
Outros autores:	Tong, H.M., Tu K.N.
Formato:	Artigo
Idioma:	English
Những chủ đề:	Current stressing Diffusion Joule heating Microelectronic packaging Reliability Thermal gradient Underbump metallizaiton
Các nhãn:	Engadir etiqueta Sen Etiquetas, Sexa o primeiro en etiquetar este rexistro!

Thư viện lưu trữ:	Thư viện Trường Đại học Đà Lạt

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