Electromigration and thermomigration in pb-free flip-chip solder joints /

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Electromigration and thermomigration in pb-free flip-chip solder joints /

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书目详细资料
主要作者:	Chen, Chih.
其他作者:	Tong, H.M., Tu K.N.
格式:	Bài viết
语言:	English
主题:	Current stressing Diffusion Joule heating Microelectronic packaging Reliability Thermal gradient Underbump metallizaiton
标签:	添加标签没有标签, 成为第一个标记此记录!

Thư viện lưu trữ:	Thư viện Trường Đại học Đà Lạt

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