Thin-body effects in double-gate tunnel field-effect transistors

Scaling down the body thickness (Tb) of double-gate tunnel field-effect transistors (DG-TFETs) is helpful in suppressing short-channel effects (SCEs), but it may give rise to thin-body effects (TBEs). Based on 2-D device simulations, this study examines the mechanisms and influences of TBEs in DG-TF...

Mô tả đầy đủ

Đã lưu trong:
Chi tiết về thư mục
Những tác giả chính: Nguyễn, Đăng Chiến, Bui Huu Thai, Chun-Hsing Shih
Định dạng: Journal article
Ngôn ngữ:English
Được phát hành: IOP Publishing 2024
Những chủ đề:
Truy cập trực tuyến:https://scholar.dlu.edu.vn/handle/123456789/3287
Các nhãn: Thêm thẻ
Không có thẻ, Là người đầu tiên thẻ bản ghi này!
Thư viện lưu trữ: Thư viện Trường Đại học Đà Lạt
id oai:scholar.dlu.edu.vn:123456789-3287
record_format dspace
institution Thư viện Trường Đại học Đà Lạt
collection Thư viện số
language English
topic Thin-body effect
double-gate
band-to-band tunneling
tunnel field-effect transistor
spellingShingle Thin-body effect
double-gate
band-to-band tunneling
tunnel field-effect transistor
Nguyễn, Đăng Chiến
Bui Huu Thai
Chun-Hsing Shih
Thin-body effects in double-gate tunnel field-effect transistors
description Scaling down the body thickness (Tb) of double-gate tunnel field-effect transistors (DG-TFETs) is helpful in suppressing short-channel effects (SCEs), but it may give rise to thin-body effects (TBEs). Based on 2-D device simulations, this study examines the mechanisms and influences of TBEs in DG-TFETs as Tb is scaled down. Differently from previous beliefs, the on-current degradation in thin-body DG-TFETs is not mainly caused by the volume effect, but rather by a newly defined TBE named lateralization effect. This is because the lateralization of tunneling direction significantly increases tunnel width, whereas the reduction of tunneling volume is quite limited due to narrow tunneling regions. To study the Tb-dependence of current, therefore, the vertical tunneling has to be taken into consideration. When considered as a TBE, the fringing field effect caused by reduction in Tb is not significant in degrading the on-current of thin-body DG-TFETs because the narrow tunneling regions are strongly gate-controlled. The only TBE that enhances the on-current is the coupling effect, but its role is only significant for low-bandgap bodies in which the coupling effect can efficiently promote the tunneling towards the body center. Not as previously thought that the quantum confinement effect (QCE) monotonically increased, it even decreases as Tb decreases down to sub-10 nm before turning to increase, thanks to the space sharing between proximate local quantum wells. A comprehensive understanding of the TBEs is useful for providing design insight, especially for determining the optimal Tb to maximize the on-current.
format Journal article
author Nguyễn, Đăng Chiến
Bui Huu Thai
Chun-Hsing Shih
author_facet Nguyễn, Đăng Chiến
Bui Huu Thai
Chun-Hsing Shih
author_sort Nguyễn, Đăng Chiến
title Thin-body effects in double-gate tunnel field-effect transistors
title_short Thin-body effects in double-gate tunnel field-effect transistors
title_full Thin-body effects in double-gate tunnel field-effect transistors
title_fullStr Thin-body effects in double-gate tunnel field-effect transistors
title_full_unstemmed Thin-body effects in double-gate tunnel field-effect transistors
title_sort thin-body effects in double-gate tunnel field-effect transistors
publisher IOP Publishing
publishDate 2024
url https://scholar.dlu.edu.vn/handle/123456789/3287
_version_ 1798256976440852480
spelling oai:scholar.dlu.edu.vn:123456789-32872024-03-01T02:47:28Z Thin-body effects in double-gate tunnel field-effect transistors Nguyễn, Đăng Chiến Bui Huu Thai Chun-Hsing Shih Thin-body effect double-gate band-to-band tunneling tunnel field-effect transistor Scaling down the body thickness (Tb) of double-gate tunnel field-effect transistors (DG-TFETs) is helpful in suppressing short-channel effects (SCEs), but it may give rise to thin-body effects (TBEs). Based on 2-D device simulations, this study examines the mechanisms and influences of TBEs in DG-TFETs as Tb is scaled down. Differently from previous beliefs, the on-current degradation in thin-body DG-TFETs is not mainly caused by the volume effect, but rather by a newly defined TBE named lateralization effect. This is because the lateralization of tunneling direction significantly increases tunnel width, whereas the reduction of tunneling volume is quite limited due to narrow tunneling regions. To study the Tb-dependence of current, therefore, the vertical tunneling has to be taken into consideration. When considered as a TBE, the fringing field effect caused by reduction in Tb is not significant in degrading the on-current of thin-body DG-TFETs because the narrow tunneling regions are strongly gate-controlled. The only TBE that enhances the on-current is the coupling effect, but its role is only significant for low-bandgap bodies in which the coupling effect can efficiently promote the tunneling towards the body center. Not as previously thought that the quantum confinement effect (QCE) monotonically increased, it even decreases as Tb decreases down to sub-10 nm before turning to increase, thanks to the space sharing between proximate local quantum wells. A comprehensive understanding of the TBEs is useful for providing design insight, especially for determining the optimal Tb to maximize the on-current. 57 21 215301 2024-03-01T02:47:25Z 2024-03-01T02:47:25Z 2024 Journal article Bài báo đăng trên tạp chí thuộc ISI, bao gồm book chapter https://scholar.dlu.edu.vn/handle/123456789/3287 10.1088/1361-6463/ad2ab1 en Nghiên cứu tối ưu hóa các tham số của thân linh kiện nâng cao đặc tính điện của các transistor hiệu ứng trường xuyên hầm (TFET) Journal of Physics D: Applied Physics 1361-6463 B2023-DLA-03 [1] Bhattacharya S, Tripathi S L and Kamboj V K 2023 Eng. Comput. 39 1415-1458 [2] Kumawat P K, Birla S and Singh N 2023 Mater. Today: Proc. 79 292–296 [3] Glass S, Driesch N, Strangio S, Schulte-Braucks C, Rieger T, Narimani K, Buca D, Mantl S and Zhao Q T 2017 Appl. Phys. Lett. 111 263504 [4] Baek J-M et al. 2022 Solid State Electron. 197 108447 [5] Lu H and Seabaugh A 2014 IEEE J. Electron Devices Soc. 2 44-49 [6] Lin Z, Chen P, Ye L, Yan X, Dong L, Zhang S, Yang Z, Peng C, Wu X and Chen J 2020 IEEE Trans. Circuits Syst. I: Regul. Pap. 67 4918-4931 [7] Chien N D, Anh T T K, Chen Y-H and Shih C-H 2019 Microelectron. Eng. 216 111061 [8] Shih C-H, Chien N D, Tran H-D and Chuan P V 2020 Appl. Phys. A 126 66 [9] Kaniselvan M and Yoon Y 2021 Appl. Phys. Lett. 119 073102 [10] Gopal G, Garg H, Agrawal H and Varma T 2022 Semicond. Sci. Technol. 37 105006 [11] Panwar S, Srivastava S, Shashidhara M and Acharya A 2023 IEEE Trans. Dielectr. Electr. Insul. 30 1066-1071 [12] Ohashi K, Fujimatsu M, Iwata S and Miyamoto Y 2015 Jpn. J. Appl. Phys. 54 04DF10 [13] Liu L, Mohata D and Data S 2012 IEEE Trans. Electron Devices 59 902-908 [14] Ma W C-Y, Hsu H-S, Fang C-C, Jao C-Y and Liao T-H 2018 Thin Solid Films 660 926-930 [15] Boucart K and Ionescu M 2006 European Solid-State Device Research Conference (Montreux, Switzerland) pp. 383-386 [16] Toh E-H, Wang G H, Samudra G and Yeo Y-C 2007 Appl. Phys. Lett. 90 263507 [17] Chawla T, Khosla M and Raj B 2021 Microelectron J. 114 105125 [18] Gopal G and Varma T 2022 Silicon 14 6553–6563 [19] Wang P, Zhuang Y Q, Li C, Jiang Z and Liu Y Q 2016 Microelectron. Reliab. 59 30-36 [20] Guha S, Pachal P and Ghosh S 2020 Superlattices Microstruct. 146 106657 [21] Chen C-Y, Ameen T A, Ilatikhameneh H, Rahman R, Klimeck G and Appenzeller J 2018 IEEE Trans. Electron Devices 65 4614-4621 [22] Mallik A and Chattopadhyay A 2012 IEEE Trans. Electron Devices 59 277-282 [23] Wang Y, Wang Y-F, Sun L-L, Xue W and Cao F 2016 Micro Nano Lett. 11 472-475 [24] Lu Y, Seabaugh A, Fay P, Koester S J, Laux S E, Haensch W and Koswatta S O 2010 Device Research Conference (Notre Dame, USA) pp. 17-18 [25] Vandenberghe W G, Soree B, Magnus W, Fischetti M V, Verhulst A S and Groeseneken G 2011 International Electron Devices Meeting (Washington, USA) pp. 1-4 [26] Beneventi G B, Gnani E, Gnudi A, Reggiani S and Baccarani G 2015 IEEE Trans. Electron Devices 62 44-51 [27] Padilla J L, Gamiz F and Godoy A 2012 IEEE Electron Device Lett. 33 1342-1344 [28] Wang Z, Wang L, En Y and Jiang X-W 2017 J. Appl. Phys. 121 224503 [29] Cherik I C, Mohammadi S and Orouji A A 2022 IEEE Trans. Electron Devices 69 364-369 [30] Dharmender, Nigam K K, Yadav P and Kumar A 2023 Int. J. Electron. DOI: 10.1080/00207217.2023.2173804 [31] Taurus Medici User Guide, Version R-2020.09 (Synopsys Inc.) [32] Chaturvedi P and Goyal N 2012 International Caribbean Conference on Devices (Playa del Carmen, Mexico) pp. 1-4 [33] Shih C-H and Chien N D 2014 IEEE Trans. Electron Devices 61 1907-1913 [34] Kane E O 1961 J. Appl. Phys. 32 83-91 [35] Levinshtein M, Rumyantsev S and Shur M 1996 World Scientific, Hanbook series on semiconductor parameters, vol. 1 & 2 [36] Kim D, Krishnamohan T, Smith L, Philip Wong H-S and Saraswat K C 2008 Device Research Conference (South Bend, USA) pp. 57-58 [37] Smet Q. et al. 2014 J. Appl. Phys. 115 184503 [38] Caughey D M and Thomas R E 1967 Proc. IEEE 55 2192-2193 [39] Sotoodeh M, Khalid A H and Rezazadeh A A 2000 J. Appl. Phys. 87 2890 [40] Jain S and Roulston D 1991 Solid-State Electron. 34 453-465 [41] Smets Q, Verhulst A S, Simoen E, Gundlach, Richter C, Collaert N and Heyns M M 2017 IEEE Trans. Electron Devices 64 3622-3626 [42] Wan J, Royer C L, Zaslavsky A and Cristoloveanu S 2011 Solid-State Electron. 65-66 226-233 [43] Noguchi M, Kim S H, Yokoyama M, Ichikawa O, Osada T, Hata M, Takenaka M and Takagi S 2015 J. Appl. Phys. 118 045712 [44] Mallik A and Chattopadhyay A 2011 IEEE Trans. Electron Devices 58 4250-4257 IOP Publishing England