Improving the electrical properties of probe tip using gold recoating
During the electrical testing in semiconductor packages, the probe and ball grid array (BGA) carrier play the key role to bridge between load board and integrated circuit components where the probe serves as the media for signal transmission and electrical...
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| Principais autores: | , , , |
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| Formato: | Conference paper |
| Idioma: | English |
| Publicado em: |
Taiwan (China)
2024
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| Acesso em linha: | https://scholar.dlu.edu.vn/handle/123456789/3302 |
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| Thư viện lưu trữ: | Thư viện Trường Đại học Đà Lạt |
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