Improving the electrical properties of probe tip using gold recoating
During the electrical testing in semiconductor packages, the probe and ball grid array (BGA) carrier play the key role to bridge between load board and integrated circuit components where the probe serves as the media for signal transmission and electrical...
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Taiwan (China)
2024
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| Truy cập trực tuyến: | https://scholar.dlu.edu.vn/handle/123456789/3302 |
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oai:scholar.dlu.edu.vn:123456789-33022024-03-02T09:26:29Z Improving the electrical properties of probe tip using gold recoating Hsiang-Hua Bai Chun-Hsing Shih Ming-Kun Huang Nguyễn, Đăng Chiến During the electrical testing in semiconductor packages, the probe and ball grid array (BGA) carrier play the key role to bridge between load board and integrated circuit components where the probe serves as the media for signal transmission and electrical measurement. After production and testing for long durations, the probe surface ages and wears out because of long term contact with the solder ball of the device. To solve this problem, we present a method of first polishing the original probe surface that is susceptible to wear and tea, and then recoating a layer of Au on the surface via Au electroplating. After the electrical evaluations used in practical testing and the physical examinations through Energy Dispersive Spectroscope (EDS) and Scanning Electron Microscope (SEM), experimental results show that the gold recoating can reduce the contact resistance, enhance the entire performance of the probe, and thus, increase its lifetime. 2024-03-02T09:26:27Z 2024-03-02T09:26:27Z 2009 Conference paper Bài báo đăng trên KYHT trong và ngoài nước (không có ISBN) https://scholar.dlu.edu.vn/handle/123456789/3302 en International Electron Devices and Materials Symposium (IEDMS) [1] I. Anjoh, A. Nishimura, S. Eguchi, “Advanced IC packaging for the future applications,” Electron Devices, IEEE Transactions on, Vol. 45, No. 3, Mar 1998, pp. 743-752. [2] International Technology Roadmap for Semiconductors (ITRS), 2008 edition. Taiwan (China) |
| institution |
Thư viện Trường Đại học Đà Lạt |
| collection |
Thư viện số |
| language |
English |
| description |
During the electrical testing in semiconductor
packages, the probe and ball grid array (BGA) carrier play
the key role to bridge between load board and integrated
circuit components where the probe serves as the media for
signal transmission and electrical measurement. After
production and testing for long durations, the probe surface
ages and wears out because of long term contact with the
solder ball of the device. To solve this problem, we present a
method of first polishing the original probe surface that is
susceptible to wear and tea, and then recoating a layer of Au
on the surface via Au electroplating. After the electrical
evaluations used in practical testing and the physical
examinations through Energy Dispersive Spectroscope (EDS)
and Scanning Electron Microscope (SEM), experimental
results show that the gold recoating can reduce the contact
resistance, enhance the entire performance of the probe, and
thus, increase its lifetime. |
| format |
Conference paper |
| author |
Hsiang-Hua Bai Chun-Hsing Shih Ming-Kun Huang Nguyễn, Đăng Chiến |
| spellingShingle |
Hsiang-Hua Bai Chun-Hsing Shih Ming-Kun Huang Nguyễn, Đăng Chiến Improving the electrical properties of probe tip using gold recoating |
| author_facet |
Hsiang-Hua Bai Chun-Hsing Shih Ming-Kun Huang Nguyễn, Đăng Chiến |
| author_sort |
Hsiang-Hua Bai |
| title |
Improving the electrical properties of probe tip using gold recoating |
| title_short |
Improving the electrical properties of probe tip using gold recoating |
| title_full |
Improving the electrical properties of probe tip using gold recoating |
| title_fullStr |
Improving the electrical properties of probe tip using gold recoating |
| title_full_unstemmed |
Improving the electrical properties of probe tip using gold recoating |
| title_sort |
improving the electrical properties of probe tip using gold recoating |
| publisher |
Taiwan (China) |
| publishDate |
2024 |
| url |
https://scholar.dlu.edu.vn/handle/123456789/3302 |
| _version_ |
1798256983686512640 |