Improving the electrical properties of probe tip using gold recoating
During the electrical testing in semiconductor packages, the probe and ball grid array (BGA) carrier play the key role to bridge between load board and integrated circuit components where the probe serves as the media for signal transmission and electrical...
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| Những tác giả chính: | , , , |
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| Định dạng: | Conference paper |
| Ngôn ngữ: | English |
| Được phát hành: |
Taiwan (China)
2024
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| Truy cập trực tuyến: | https://scholar.dlu.edu.vn/handle/123456789/3302 |
| Các nhãn: |
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| Thư viện lưu trữ: | Thư viện Trường Đại học Đà Lạt |
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| Tóm tắt: | During the electrical testing in semiconductor
packages, the probe and ball grid array (BGA) carrier play
the key role to bridge between load board and integrated
circuit components where the probe serves as the media for
signal transmission and electrical measurement. After
production and testing for long durations, the probe surface
ages and wears out because of long term contact with the
solder ball of the device. To solve this problem, we present a
method of first polishing the original probe surface that is
susceptible to wear and tea, and then recoating a layer of Au
on the surface via Au electroplating. After the electrical
evaluations used in practical testing and the physical
examinations through Energy Dispersive Spectroscope (EDS)
and Scanning Electron Microscope (SEM), experimental
results show that the gold recoating can reduce the contact
resistance, enhance the entire performance of the probe, and
thus, increase its lifetime. |
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