Electromigration and thermomigration in pb-free flip-chip solder joints /

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Electromigration and thermomigration in pb-free flip-chip solder joints /

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Λεπτομέρειες βιβλιογραφικής εγγραφής
Κύριος συγγραφέας:	Chen, Chih.
Άλλοι συγγραφείς:	Tong, H.M., Tu K.N.
Μορφή:	Άρθρο
Γλώσσα:	English
Θέματα:	Current stressing Diffusion Joule heating Microelectronic packaging Reliability Thermal gradient Underbump metallizaiton
Ετικέτες:	Προσθήκη ετικέτας Δεν υπάρχουν, Καταχωρήστε ετικέτα πρώτοι!

Thư viện lưu trữ:	Thư viện Trường Đại học Đà Lạt

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