Electromigration and thermomigration in pb-free flip-chip solder joints /

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Electromigration and thermomigration in pb-free flip-chip solder joints /

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Detalles Bibliográficos
Autor principal:	Chen, Chih.
Otros Autores:	Tong, H.M., Tu K.N.
Formato:	Artículo
Lenguaje:	English
Materias:	Current stressing Diffusion Joule heating Microelectronic packaging Reliability Thermal gradient Underbump metallizaiton
Etiquetas:	Agregar Etiqueta Sin Etiquetas, Sea el primero en etiquetar este registro!

Thư viện lưu trữ:	Thư viện Trường Đại học Đà Lạt

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