Electromigration and thermomigration in pb-free flip-chip solder joints /

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Electromigration and thermomigration in pb-free flip-chip solder joints /

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Xehetasun bibliografikoak
Egile nagusia:	Chen, Chih.
Beste egile batzuk:	Tong, H.M., Tu K.N.
Formatua:	Artikulua
Hizkuntza:	English
Gaiak:	Current stressing Diffusion Joule heating Microelectronic packaging Reliability Thermal gradient Underbump metallizaiton
Etiketak:	Etiketa erantsi Etiketarik gabe, Izan zaitez lehena erregistro honi etiketa jartzen!

Thư viện lưu trữ:	Thư viện Trường Đại học Đà Lạt

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