Electromigration and thermomigration in pb-free flip-chip solder joints /

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Electromigration and thermomigration in pb-free flip-chip solder joints /

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Détails bibliographiques
Auteur principal:	Chen, Chih.
Autres auteurs:	Tong, H.M., Tu K.N.
Format:	Article
Langue:	English
Sujets:	Current stressing Diffusion Joule heating Microelectronic packaging Reliability Thermal gradient Underbump metallizaiton
Tags:	Ajouter un tag Pas de tags, Soyez le premier à ajouter un tag!

Thư viện lưu trữ:	Thư viện Trường Đại học Đà Lạt

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