Electromigration and thermomigration in pb-free flip-chip solder joints /

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Electromigration and thermomigration in pb-free flip-chip solder joints /

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Sonraí Bibleagrafaíochta
Príomhúdar:	Chen, Chih.
Údair Eile:	Tong, H.M., Tu K.N.
Formáid:	Bài viết
Teanga:	English
Ábhair:	Current stressing Diffusion Joule heating Microelectronic packaging Reliability Thermal gradient Underbump metallizaiton
Clibeanna:	Cuir Clib Leis Gan Chlibeanna, Bí ar an gcéad duine leis an taifead seo a chlibeáil!

Thư viện lưu trữ:	Thư viện Trường Đại học Đà Lạt

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