Electromigration and thermomigration in pb-free flip-chip solder joints /

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Electromigration and thermomigration in pb-free flip-chip solder joints /

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Bibliografski detalji
Glavni autor:	Chen, Chih.
Daljnji autori:	Tong, H.M., Tu K.N.
Format:	Članak
Jezik:	English
Teme:	Current stressing Diffusion Joule heating Microelectronic packaging Reliability Thermal gradient Underbump metallizaiton
Oznake:	Dodaj oznaku Bez oznaka, Budi prvi tko označuje ovaj zapis!

Thư viện lưu trữ:	Thư viện Trường Đại học Đà Lạt

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